Electronic Products & Technology


Products


Product
June 9, 2020

MLCC with 0.1μF capacitance serves wearables

MURATA?GRM011R60J104M multi-layer ceramic capacitor (MLCC) provides a maximum capacitance of 0.1μF in a 008004 (0.25×0.125mm) package. The design features a capacitance tolerance of ±20 percent, usage temperature range of -55°C to 85°C, and rated voltage of 6.3Vdc. By using proprietary

Product
June 9, 2020

SiGe rectifiers combine efficiency, thermal stability, space-savings

NEXPERIA PMEGxGxELR/P silicon germanium (SiGe) rectifiers with 120 V, 150 V, and 200 V reverse voltages combine the high efficiency of their Schottky counterparts with the thermal stability of fast recovery diodes. Targeting automotive, communications infrastructure and server markets, the

Product
June 8, 2020

Ruggedized connectors boost performance in extreme conditions.

Amphenol Ruggedized Connectors (ARC) provide 50 ohm impedance and dc to 6GHz frequency. ARC family of products deliver a reliable threaded interface for outdoor installation, as well single-body construction for consistent electrical performance. This lends to improved durability in extreme

Product
June 8, 2020

SMT pcb edge connectors are low profile

EMX ENTERPRISES Keystone Electronics series of SMT printed circuit board (pcb) connectors transmit signals or power across pcbs. Quickly and easily set-up, the space-saving devices have a horizontal orientation making them suitable as parallel board-to-board or board-to-component alternative options for

Product
June 7, 2020

FPGA-based software provides RISC-V support

LATTICE SEMICONDUCTOR Propel software solution accelerates development of different applications based on low power, small form factor Lattice FPGAs. The design environment empowers developers of any skill level to quickly and easily design firm’s FPGA-based applications by enabling the easy

Product
June 6, 2020

Embedded software building on Linux is efficient

IAR SYSTEMS Embedded Workbench C/C++ compiler and debugger software toolchain provides users with diverse microcontroller support, as well as adapted licensing options to fit different organizations’ needs. This flexibility is now extended to the build environment as the well-known build

Product
June 5, 2020

13W thermal gap filler come as gel-like sheets

FUJIPOLY AMERICA?Sarcon GR130A high-performance, thermal gap filler pad is packed as highly conformable, gel-like sheets that exhibit a thermal resistance as low as 0.02°C?in2/W at 43.5 PSI with a thermal conductivity of 13 W/m°K. Product is available in five thicknesses

Product
June 5, 2020

Flat Pack Laser alignment modules includes diode

BEA LASERS Flat Pack Laser (FPL) Alignment Modules joins firm’s alignment series of laser diode modules. The module package includes the laser diode and its housing, a mounting base and a separate power supply. Device provide low profile (20mm high)

Product
June 4, 2020

RF inductors boost RF signal quality

TDK EPCOS DEA Family of SIMID Series RF Inductors are 1812-C Qualified and feature ceramic/ferrite and ferrite drum cores with flame retardant molding or an injected molded base. The SMT devices are suitable for low pass filter applications. Products are

Product
June 4, 2020

IR LED emitter serves remote control units

NTE ELECTRONICS?NTE30116 5mm Infrared LED emitter with blue tint lens are used for remote control applications. Device utilizes the 940nm wavelength, which is what most infrared receivers are receptive to. Equipped with a 5V Vr, devices come with a 5mm

Product
June 3, 2020

EUV photodetector has 2.5mm circular active area

OPTO DIODE?SXUV5 extreme ultraviolet (EUV) photodiode has a circular active area of 2.5mm diameter. Device delivers enhanced responsivity in the 1nm to190nm wavelength region, and is specially designed to be highly stable over long periods of time when exposed to

Product
June 3, 2020

SoCs are based on RISC-V core

EFINIX Trion Series of three software defined SoCs based on the popular RISC-V core, have been optimized for Trion family of FPGAs and provide a range of compute and I/O capabilities in devices from the T8 to the T120. Devices